- 《IEEE Transactions on Components and Packaging Technologies》
- 语言：外文
- ISSN：1521-3331
- 核心刊：;pubmed;SCI科学引文索引;
- 周期：季刊
- 影响因子：2013:0;2012:0;2011:0;2010:0.962;2009:0.944;2008:0.968;2007:0.902;
- 学科分类：电子 通信
- 简介：IEEE Transactions on Components and Packaging Technologies publishes research and applications artic...
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- 简介：IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging; new developments in passive and integrated components, electrical contacts and connectors, bonding,interconnection, device reliability and failure modes, and materials for electronics; thermal management, including thermomechanics, thermal measurement, cooling technology, and thermal phenomena in electronics.
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- 出版地： IEEE;445 Hoes Lane;Piscataway New Jersey 08854
主题范围： Covers the fields of component parts, hybrid microelectronics, materials, packaging techniques, and manufacturing technology.-
- 来源数据库：
- 国家科技图书文献中心文献检索
- IEEE/IET Electronic Library (IEL) (1988－（部分出版物1950－）)
- EBSCO检索平台
